Development of new semiconductor packages using transfer molding.
We will build a collaborative system with each manufacturer to contribute to improving development speed and enhancing quality.
Our company is engaged in the development of new semiconductor packages using transfer molding. We have numerous manufacturing achievements in precision molds for semiconductor production, and thanks to these accomplishments and advanced simulation technology, we can provide optimal designs tailored to the products. By establishing a collaborative system through joint experiments and joint development with various manufacturers, we offer comprehensive proposals and follow-up development regarding materials and product shapes, in conjunction with the insights of each company. 【Benefits】 ■ Consistent support from LF to MOLD to TF ■ High quality achieved through micron-level processing precision and polished finishes ■ Extensive experience cultivated over many years *For more details, please download the PDF or feel free to contact us.
- Company：多加良製作所
- Price：Other
